AMD 携手多家中国台湾地区 OSAT 企业推进新一代 EFB 技术研发
AMD 正与日月光、矽品等企业共同开发并验证下一代基于晶圆的 2.5D 桥接互连技术；其还与力成一道成功验证了业界首款 2.5D 面板级 EFB 互连技术。
https://www.ithome.com/0/953/519.htm #AMD #先进封装 #OSAT #EFB
IT之家
npub1kx…2nkgr
2026-05-21 09:06:51 UTC
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npub1kx2trfca7zg9la28a5v9k652rdyfwrfnv3g7nwlsfglxmk32gxfqd2nkgrPublished at
2026-05-21 09:06:51 UTCEvent JSON
{
"id": "958ef6cdef38035b318e57068327b3b1a37dcb81d1fe2278487032c3eb1b79cc",
"pubkey": "b194b1a71df0905ff547ed185b6a8a1b48970d336451e9bbf04a3e6dda2a4192",
"created_at": 1779354411,
"kind": 1,
"tags": [
[
"t",
"it之家"
],
[
"t",
"amd"
],
[
"t",
"先进封装"
],
[
"t",
"osat"
],
[
"t",
"efb"
],
[
"client",
"Nostr.moe Bot"
]
],
"content": "AMD 携手多家中国台湾地区 OSAT 企业推进新一代 EFB 技术研发\n\nAMD 正与日月光、矽品等企业共同开发并验证下一代基于晶圆的 2.5D 桥接互连技术；其还与力成一道成功验证了业界首款 2.5D 面板级 EFB 互连技术。\n\nhttps://www.ithome.com/0/953/519.htm #AMD #先进封装 #OSAT #EFB",
"sig": "4b07085c5d2aa8eaf968e5cf5a4e940eba24450bdf418d8960796c05e9191c871d714008d4676562e9b7b2beac5ad58fb1200ac53d1462d4e6bc8affd69ffd23"
}