The thing is: it's not manufacturing node. Apple used TSMC N3B for the M3 and is now featuring N3E. Lunar Lake uses N3B, while the X Elite uses N4P.
It's also not RAM. All of the mentioned chip families use RAM chips right next to the SoC die, interconnecting with either LPDDR5 (M3) or LPDDR5X (M4, Lunar Lake, X Elite).
It's very obviously the core design.
Xerz đ
npub1s7âŚ2ujeh
2024-11-16 16:59:51 UTC
in reply to nevent1qâŚc2wp
Author Public Key
npub1s7d5rapesxy9lcktyytt25sfld2776x4v32hx6ylql0qnzv92ayqe2ujehSeen on
wss://relay.momostr.pinkPublished at
2024-11-16 16:59:51 UTCEvent JSON
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"content": "The thing is: it's not manufacturing node. Apple used TSMC N3B for the M3 and is now featuring N3E. Lunar Lake uses N3B, while the X Elite uses N4P.\r\n\r\nIt's also not RAM. All of the mentioned chip families use RAM chips right next to the SoC die, interconnecting with either LPDDR5 (M3) or LPDDR5X (M4, Lunar Lake, X Elite).\r\n\r\nIt's very obviously the core design.",
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