DJ🌞:donor: on Nostr: There seems to be three distinct memory arrays on the die, located left, top, and ...

There seems to be three distinct memory arrays on the die, located left, top, and right. The datasheet mentions that the max spec configuration is 2KB IRAM, 2KB XRAM, and 128K mask ROM. I strongly suspect they just use the same die for all of them.

The mask ROM is easy to spot, it is the largest one and consists of 8 blocks. Block structure is rather peculiar with sawtooth-like patterns all across. So far I've only seen Siemens/Infineon employ this particular design; if anyone has any further info please leave a comment as I'd love to learn more about it.